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Researcher · Advanced Semiconductor Engineering (Taiwan) · Taiwan

Meng-Kai Shih

Meng-Kai Shih publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Advanced Surface Polishing Techniques.

ORCID 0000-0002-1975-924X OpenAlex
World rank
#7,599,245
of 7,710,434 ranked researchers
Rank in Taiwan
#56,582
of 57,035
Works
73
Citations
699
Citations per work
9.6
h-index
13
i10-index 21Top 37% in Electrical and Electronic Engineering
Meng-Kai Shih

What does Meng-Kai Shih research?

Meng-Kai Shih's work is mostly in Engineering (94%), Materials Science (2%).

Physical Sciences: 70 works · 95.7% of their workEngineering: 68 works · 93.8% of their workElectrical and Electronic Engineering: 49 works · 67.3% of their workMechanical Engineering: 8 works · 10.9% of their workBiomedical Engineering: 5 works · 7.1% of their workMechanics of Materials: 5 works · 7.1% of their workAutomotive Engineering: 1 works · 1.4% of their workMaterials Science: 1 works · 1.9% of their workElectronic, Optical and Magnetic Materials: 1 works · 1.9% of their workEverything else: 3 works · 4.3% of their workTHEIR WORKMeng-Kai Shih73works
Physical Sciences96%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering6893.8%
    2. Materials Science11.9%
  2. Everything else34.3%
  1. 1Electrical and Electronic Engineering67% of their works
  2. 2Mechanical Engineering11% of their works
  3. 3Mechanics of Materials7% of their works
  4. 4Biomedical Engineering7% of their works
  5. 5Electronic, Optical and Magnetic Materials2% of their works
  6. 6Automotive Engineering1% of their works

Research topics

Which keywords describe Meng-Kai Shih's research?

The keywords of their largest research topics: High-Temperature Electronics, Thermal Behavior, Interfacial Reactions, Lead-free Solders, Thermal Management, Interconnect, Through-Silicon Via and Chemical Mechanical Planarization.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 20 words, with their numbers
  1. High-Temperature Electronics622 topics
  2. Thermal Behavior602 topics
  3. Interfacial Reactions551 topic
  4. Lead-free Solders551 topic
  5. Thermal Management532 topics
  6. Interconnect461 topic
  7. Through-Silicon Via461 topic
  8. Chemical Mechanical Planarization121 topic
  9. Failure Analysis121 topic
  10. Integrated Circuits121 topic
  11. Material Removal Mechanism121 topic
  12. Reliability122 topics
  13. Silicon Carbide71 topic
  14. Wide Bandgap Semiconductors71 topic
  15. Cohesive Zone Models61 topic
  16. Delamination61 topic
  17. EMI61 topic
  18. Electromagnetic Compatibility61 topic
  19. MEMS51 topic
  20. Silicon51 topic

Where does Meng-Kai Shih work?

Meng-Kai Shih's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.

How many publications and citations does Meng-Kai Shih have?

OpenAlex counts 73 works and 699 citations for Meng-Kai Shih, an h-index of 13, ranking #7,599,245 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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