Mollie Benson
Mollie Benson publishes mostly in Electrical and Electronic Engineering, Hardware and Architecture and Electronic, Optical and Magnetic Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and VLSI and Analog Circuit Testing.
- World rank
- #6,878,996 of 7,710,434 ranked researchers
- Rank in Germany
- #339,648 of 364,343
- Works
- 18
- Citations
- 16
- Citations per work
- 0.9
What does Mollie Benson research?
Mollie Benson's work is mostly in Engineering (68%), Computer Science (9%), Materials Science (6%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1583.0%
- Engineering1267.9%
- Computer Science29.4%
- Materials Science15.7%
- Everything else211.3%
- Health Sciences13.8%
- Medicine13.8%
- Life Sciences01.9%
- 1Electrical and Electronic Engineering66% of their works
- 2Hardware and Architecture9% of their works
- 3Electronic, Optical and Magnetic Materials6% of their works
- 4Surgery4% of their works
- 5Automotive Engineering2% of their works
- 6Insect Science2% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- VLSI and Analog Circuit Testing
- Electromagnetic Compatibility and Noise Suppression
- Integrated Circuits and Semiconductor Failure Analysis
- Copper Interconnects and Reliability
- Forensic Entomology and Diptera Studies
- Vehicle Dynamics and Control Systems
Which keywords describe Mollie Benson's research?
The keywords of their largest research topics: Electromigration, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Electromagnetic Compatibility, Embedded Cores and EMI.
- Forensic Entomology
- Control Systems
- Low-k Dielectrics
- Failure Analysis
- Embedded Cores
- EMI
- Interconnect
- Interfacial Reactions
- Electromigration
- Lead-free Solders
- Through-Silicon Via
- Electromagnetic Compatibility
- Test Data Compression
- Integrated Circuits
- Microelectronics
- Decomposition
- Vehicle Dynamics
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 17 words, with their numbers
- Electromigration172 topics
- Interfacial Reactions141 topic
- Lead-free Solders141 topic
- Interconnect111 topic
- Through-Silicon Via111 topic
- EMI51 topic
- Electromagnetic Compatibility51 topic
- Embedded Cores51 topic
- Test Data Compression51 topic
- Failure Analysis31 topic
- Integrated Circuits31 topic
- Low-k Dielectrics31 topic
- Microelectronics31 topic
- Control Systems11 topic
- Decomposition11 topic
- Forensic Entomology11 topic
- Vehicle Dynamics11 topic
Where does Mollie Benson work?
Mollie Benson's main affiliation in the publication record is NXP (Germany), Germany.
How many publications and citations does Mollie Benson have?
OpenAlex counts 18 works and 16 citations for Mollie Benson, an h-index of 3, ranking #6,878,996 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
Discussion
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