Yi‐Shao Lai
Yi‐Shao Lai publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Copper Interconnects and Reliability.
- World rank
- #2,666,359 of 7,710,434 ranked researchers
- Rank in Taiwan
- #17,451 of 57,035
- Works
- 238
- Citations
- 3.8k
- Citations per work
- 15.9
What does Yi‐Shao Lai research?
Yi‐Shao Lai's work is mostly in Engineering (82%), Materials Science (10%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences22092.3%
- Engineering19682.4%
- Materials Science249.9%
- Everything else187.7%
- 1Electrical and Electronic Engineering57% of their works
- 2Mechanical Engineering11% of their works
- 3Mechanics of Materials10% of their works
- 4Materials Chemistry6% of their works
- 5Electronic, Optical and Magnetic Materials4% of their works
- 6Biomedical Engineering3% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Copper Interconnects and Reliability
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced Welding Techniques Analysis
- Metal and Thin Film Mechanics
- Electrostatic Discharge in Electronics
- Electromagnetic Compatibility and Noise Suppression
Which keywords describe Yi‐Shao Lai's research?
The keywords of their largest research topics: Electromigration, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Thin Films, Mechanical Properties and Low-k Dielectrics.
- EMI
- CMOS Technology
- Coatings
- Friction Stir Welding
- Failure Analysis
- Low-k Dielectrics
- Thin Films
- Interconnect
- Interfacial Reactions
- Electromigration
- Lead-free Solders
- Through-Silicon Via
- Mechanical Properties
- Microelectronics
- Integrated Circuits
- Processing
- Nanoindentation
- ESD Protection
- Electromagnetic Compatibility
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 19 words, with their numbers
- Electromigration2322 topics
- Interfacial Reactions2041 topic
- Lead-free Solders2041 topic
- Interconnect1131 topic
- Through-Silicon Via1131 topic
- Thin Films492 topics
- Mechanical Properties442 topics
- Low-k Dielectrics281 topic
- Microelectronics281 topic
- Failure Analysis271 topic
- Integrated Circuits271 topic
- Friction Stir Welding231 topic
- Processing231 topic
- Coatings211 topic
- Nanoindentation211 topic
- CMOS Technology201 topic
- ESD Protection201 topic
- EMI181 topic
- Electromagnetic Compatibility181 topic
Where does Yi‐Shao Lai work?
Yi‐Shao Lai's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.
How many publications and citations does Yi‐Shao Lai have?
OpenAlex counts 238 works and 3,782 citations for Yi‐Shao Lai, an h-index of 32, ranking #2,666,359 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
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