Indiana Microelectronics (United States)

Location quotient across every field it publishes in: outside the ring is more than an institution of this size would be expected to publish, inside it is less.

By volume: Experimental Learning in Engineering, Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Microwave Engineering and Waveguides.

1. 1 Experimental Learning in Engineering Media Technology 1 works
2. 2 Electronic Packaging and Soldering Technologies Electrical and Electronic Engineering 1 works
3. 3 3D IC and TSV technologies Electrical and Electronic Engineering 0 works
4. 4 Microwave Engineering and Waveguides Electrical and Electronic Engineering 0 works
5. 5 Engineering Education and Pedagogy Architecture 0 works
6. 6 Enzyme Structure and Function Materials Chemistry 0 works
7. 7 Protein Structure and Dynamics Molecular Biology 0 works
8. 8 Nanomaterials and Printing Technologies Electrical and Electronic Engineering 0 works
9. 9 Machine Learning in Bioinformatics Molecular Biology 0 works
10. 10 Integrated Circuits and Semiconductor Failure Analysis Electrical and Electronic Engineering 0 works

Against the world’s own shares — the tick on each track. Both are shares of its output, so they sit on one scale and can be read against each other as well as against the world.

• Purdue University West Lafayette
• Center for Information and Numerical Data Analysis and Synthesis (United States)
• MED Institute
• Bioanalytical Systems (United States)
• Cook Research (United States)
• National Soil Erosion Research Laboratory
• Endocyte (United States)
• PC Krause & Associates (United States)