Siliconware Precision Industries (Taiwan)

The fields where it stands highest, 2022–2025, ranked among every institution above the floor in each field.

Each strip is that field’s whole ranked pool, with the notch where Siliconware Precision Industries (Taiwan) sits in it, in the colour of the band that rank falls in. The track under the rate is the rate itself: it carries no world mark, because the world rate differs by field (from about 6% to 21% in this record).

1. Engineering#7,008 #5,655
2. Physical Sciences#18,106 #11,269
3. Electrical and Electronic Engineering#3,465 #2,234

A dot further right is a better standing. Fields it was not ranked in over the whole record are left out.

Where its research is concentrated relative to its size: Electrical and Electronic Engineering takes 17.6× the share of its output that it takes of world research.

1. Electrical and Electronic EngineeringSubfield · 64.1 works18×
2. EngineeringField · 87.7 works5.7×

Location quotient, a volume reading rather than an impact one. It surfaces small, lopsided specialities.

Location quotient across every field it publishes in: outside the ring is more than an institution of this size would be expected to publish, inside it is less.

• Engineering 5.7×
• Materials Science 2.3×
• Computer Science 0.5×
• Physics and Astronomy 0.4×
• Environmental Science 0.2×
• Energy 0.2×
• Chemistry 0.1×

Ranked on the composite score, Andrew H. Kang, Eason Chen and Yu-Po Wang lead among researchers whose main affiliation is Siliconware Precision Industries (Taiwan).

1. 1 🇹🇼 Andrew H. Kang Taiwan · #142,584 worldwide 227 citations · 31 works
2. 2 🇹🇼 Eason Chen Taiwan · #792,348 worldwide 41 citations · 22 works
3. 3 🇹🇼 Yu-Po Wang Taiwan · #1,485,929 worldwide 17 citations · 25 works

By fractional works in 2022–2025, weighted toward what it does more of than the world: Thermal Management, Electromigration, Nanoparticles, Interconnect, Through-Silicon Via, High-Temperature Electronics, Interfacial Reactions and Lead-free Solders.

By volume in 2022–2025: 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Electromagnetic Compatibility and Noise Suppression and Semiconductor Lasers and Optical Devices.

1. 1 3D IC and TSV technologies Electrical and Electronic Engineering 20 works
2. 2 Electronic Packaging and Soldering Technologies Electrical and Electronic Engineering 20 works
3. 3 Electromagnetic Compatibility and Noise Suppression Electrical and Electronic Engineering 4 works
4. 4 Semiconductor Lasers and Optical Devices Electrical and Electronic Engineering 3 works
5. 5 Additive Manufacturing and 3D Printing Technologies Automotive Engineering 3 works
6. 6 VLSI and Analog Circuit Testing Hardware and Architecture 3 works
7. 7 Copper Interconnects and Reliability Electronic, Optical and Magnetic Materials 2 works
8. 8 Manufacturing Process and Optimization Industrial and Manufacturing Engineering 2 works
9. 9 Thermal properties of materials Materials Chemistry 2 works
10. 10 Integrated Circuits and Semiconductor Failure Analysis Electrical and Electronic Engineering 2 works

Against the world’s own shares — the tick on each track. Both are shares of its output, so they sit on one scale and can be read against each other as well as against the world.

Output in 2018–2022 was 26% higher than in 2013–2017.

• National Chung Hsing University
• Feng Chia University
• China Medical University
• China Medical University Hospital
• Asia University
• Chaoyang University of Technology
• Tunghai University
• Chung Shan Medical University