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Researcher · Advanced Semiconductor Engineering (Taiwan) · Taiwan

Andy Tseng

Andy Tseng publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Integrated Circuits and Semiconductor Failure Analysis.

OpenAlex
World rank
#4,848,737
of 7,710,434 ranked researchers
Rank in Taiwan
#36,923
of 57,035
Works
32
Citations
283
Citations per work
8.8
h-index
9
i10-index 9Top 59% in Electrical and Electronic Engineering
Andy Tseng

What does Andy Tseng research?

Andy Tseng's work is mostly in Engineering (83%), Materials Science (8%), Computer Science (1%).

Physical Sciences: 30 works · 92.2% of their workEngineering: 27 works · 83.4% of their workElectrical and Electronic Engineering: 23 works · 72.2% of their workMechanical Engineering: 2 works · 5.6% of their workMechanics of Materials: 2 works · 5.6% of their workMaterials Science: 2 works · 7.7% of their workMaterials Chemistry: 1 works · 4.4% of their workElectronic, Optical and Magnetic Materials: 1 works · 3.3% of their workComputer Science: 0 works · 1.1% of their workArtificial Intelligence: 0 works · 1.1% of their workEverything else: 2 works · 7.8% of their workTHEIR WORKAndy Tseng32works
Physical Sciences92%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering2783.4%
    2. Materials Science27.7%
    3. Computer Science01.1%
  2. Everything else27.8%
  1. 1Electrical and Electronic Engineering72% of their works
  2. 2Mechanical Engineering6% of their works
  3. 3Mechanics of Materials6% of their works
  4. 4Materials Chemistry4% of their works
  5. 5Electronic, Optical and Magnetic Materials3% of their works
  6. 6Artificial Intelligence1% of their works

Research topics

Which keywords describe Andy Tseng's research?

The keywords of their largest research topics: Electromigration, High-Temperature Electronics, Interfacial Reactions, Lead-free Solders, Thermal Management, Interconnect, Through-Silicon Via and Failure Analysis.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 19 words, with their numbers
  1. Electromigration262 topics
  2. High-Temperature Electronics252 topics
  3. Interfacial Reactions231 topic
  4. Lead-free Solders231 topic
  5. Thermal Management202 topics
  6. Interconnect181 topic
  7. Through-Silicon Via181 topic
  8. Failure Analysis61 topic
  9. Integrated Circuits61 topic
  10. EMI51 topic
  11. Electromagnetic Compatibility51 topic
  12. Low-k Dielectrics31 topic
  13. Microelectronics31 topic
  14. Atomic Layer Deposition21 topic
  15. High-k Dielectrics21 topic
  16. Optical Interconnects21 topic
  17. Reliability21 topic
  18. Semiconductor Lasers21 topic
  19. Wide Bandgap Semiconductors21 topic

Where does Andy Tseng work?

Andy Tseng's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.

How many publications and citations does Andy Tseng have?

OpenAlex counts 32 works and 283 citations for Andy Tseng, an h-index of 9, ranking #4,848,737 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Other researchers named Andy Tseng

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