Lam Research (United States)

The fields where it stands highest, 2022–2025, ranked among every institution above the floor in each field.

Each strip is that field’s whole ranked pool, with the notch where Lam Research (United States) sits in it, in the colour of the band that rank falls in. The track under the rate is the rate itself: it carries no world mark, because the world rate differs by field (from about 6% to 21% in this record).

Where its research is concentrated relative to its size: Electrical and Electronic Engineering takes 10.8× the share of its output that it takes of world research.

1. Electrical and Electronic EngineeringSubfield · 36.1 works11×

Location quotient, a volume reading rather than an impact one. It surfaces small, lopsided specialities.

Location quotient across every field it publishes in: outside the ring is more than an institution of this size would be expected to publish, inside it is less.

• Materials Science 5.1×
• Engineering 3.9×
• Chemical Engineering 2.3×
• Physics and Astronomy 2.1×
• Business, Management and Accounting 1.2×
• Computer Science 1.0×
• Chemistry 0.9×
• Decision Sciences 0.7×
• Agricultural and Biological Sciences 0.2×
• Mathematics 0.2×
• Biochemistry, Genetics and Molecular Biology 0.1×
• Environmental Science 0.1×
• Arts and Humanities 0.1×
• Neuroscience 0.1×
• Medicine 0.1×
• Psychology 0.1×
• Earth and Planetary Sciences 0.1×
• Energy 0.1×
• Health Professions 0.0×
• Social Sciences 0.0×
• Economics, Econometrics and Finance 0.0×

Ranked on the composite score, J. Haimson, Thorsten Lill and Reza Arghavani lead among researchers whose main affiliation is Lam Research (United States).

1. 1 🇺🇸 J. Haimson United States · #499,290 worldwide 50 citations · 16 works
2. 2 🇺🇸 Thorsten Lill United States · #1,316,379 worldwide 33 citations · 20 works
3. 3 🇺🇸 Reza Arghavani United States · #1,476,450 worldwide 16 citations · 15 works

By fractional works in 2022–2025, weighted toward what it does more of than the world: Atomic Layer Deposition, High-k Dielectrics, Thin Films, Electromigration, Nanowires, High-Resolution Patterning, Nanofabrication and Plasma Etching.

By volume in 2022–2025: Semiconductor materials and devices, Plasma Diagnostics and Applications, Copper Interconnects and Reliability and Advancements in Photolithography Techniques.

1. 1 Semiconductor materials and devices Electrical and Electronic Engineering 9 works
2. 2 Plasma Diagnostics and Applications Electrical and Electronic Engineering 5 works
3. 3 Copper Interconnects and Reliability Electronic, Optical and Magnetic Materials 4 works
4. 4 Advancements in Photolithography Techniques Electrical and Electronic Engineering 4 works
5. 5 3D IC and TSV technologies Electrical and Electronic Engineering 3 works
6. 6 Advancements in Semiconductor Devices and Circuit Design Electrical and Electronic Engineering 3 works
7. 7 Integrated Circuits and Semiconductor Failure Analysis Electrical and Electronic Engineering 3 works
8. 8 Advanced Surface Polishing Techniques Biomedical Engineering 2 works
9. 9 Additive Manufacturing and 3D Printing Technologies Automotive Engineering 2 works
10. 10 Electronic and Structural Properties of Oxides Materials Chemistry 2 works

Against the world’s own shares — the tick on each track. Both are shares of its output, so they sit on one scale and can be read against each other as well as against the world.

Output in 2018–2022 was 57% higher than in 2013–2017.

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